Effect of copper based filler composition on the strength of brazed joint

Authors

  • A. J. Sulaiman H. Faculty of Mechanical Engineering, Universiti Malaysia Pahang 26600 Pekan, Pahang, Malaysia
  • W. N. W. M. N. Hissyam Faculty of Mechanical Engineering, Universiti Malaysia Pahang 26600 Pekan, Pahang, Malaysia
  • Aiman M. H. Faculty of Mechanical Engineering, Universiti Malaysia Pahang 26600 Pekan, Pahang, Malaysia
  • M. Ishak Faculty of Mechanical Engineering, Universiti Malaysia Pahang 26600 Pekan, Pahang, Malaysia
  • T. Ariga Department of Materials Science, School of Engineering Tokai, University Kanagawa, Japan

DOI:

https://doi.org/10.15282/jmes.13.2.2019.22.0419

Keywords:

Intermetallic compound (IMC), Shear strength, temperature, Copper-based filler

Abstract

Vacuum brazing of copper-based filler was performed using pure copper plate as its based metal. The brazed joint was obtained at different temperatures, 680oC and 730oC, with same holding time, which is 30 minutes. MBF 2005 (Cu, 5.7wt.%Ni, 9.7wt.%Sn, 7.0wt.%P), MBF 2002 (Cu, 9.9wt.%Ni, 4.0wt.%Sn, 7.8wt.%P) and VZ 2250 (Cu, 7.0wt.%Ni, 9.3wt.%Sn, 6.3wt.%P) alloys were used as brazing filler materials. The intermetallic compound (IMC) and mechanical properties of the joints were investigated in detail. The result show that the interfacial microstructure of the brazed joints is Cu3P and (CuNi)2P. As the brazing temperature increase from 680oC to 730oC, the IMC become thicker leading to decrease in joining strength due to brittle IMC formation. The maximum shear strength reached 112 MPa at 680oC for MBF 2002 and 129 MPa at 730oC for MBF 2005. Hence, it is found that the composition of filler effects the strength of brazed joint.

References

A Hasap, N Noraphaiphipaksa, C Kanchanomai. The Microstructure and strength of Copper Alloy Brazing joints. Welding Research 2014; 94: 116-123.

American Welding Society. Chapter 3. Committee on Brazing and Soldering Handbook Fifth Edition. ASM International;2007.

YL Shabtay, M Ainali, A Lea. New brazing processes using anneal-resistant copper and brass alloys. Material Design 2004; 25(1): 83-89.

Satoshi K, Tetsurou K, Yukiakira H and Yasuyuki M. Wetting and Spreading Behaviour of Molten Brazing Filler Metallic Alloys on Metallic Substrate. IOP Conference Series. Materials Science and Engineering 2014; 61 012017.

Guedes A, Pinto A and Vieira M. The effect of brazing temperature on the titanium/glass ceramic bonding. Material Processing Technology. 1999; 102(6): 92-93.

Jinglong L, Zengchan H, Jiangtao X, Fusheng Z and Wen-Ya L. Study on microstructure and strength of AgNi alloy/pure Al vacuum diffusion bonded joints. Material Design. 2009; 30(80): 3265-8.

Li J, Liu Y, Tan Y, Li Y, Zhang L, Wu S and Jia P. Effect of tin addition on primary silicon recovery in Si-Al melt during solidification refining of silicon. Journal Crystal Growth. 2013; 371: 1-6.

Yongtong Cao, Jiazhen Yan, Ning Li Yi Zheng, Chenglai Xin. Effects of brazing temperature on microstructure and mechanical performance of Al2O3/AgCuTi/Fe–Ni–Co brazed joints. Journal of alloy and compound. 2015: 30-36.

O C Paiva, M A Barbosa. Brazing parameters determines the degradation and mechanical behaviour of alumina/titanium brazed joints. Journal of Materials Science. 2000; 5(35) :1165-1175.

Robert W M. Joining of Materials and Structures. First published, the United States of America. Elsevier Butterworth–Heinemann. 2004, p349-387.

Flom Y and Wang L. Flaw Tolerance in Lap Shear Brazed Joints - Part 1 Welding Journal, January 2004, p32-38.

Jing Zhang, Weiyuan Yu, Wenjiang Lu. Mechanical and microstructure of pure copper joint brazed with amorphous Cu68.5Ni15.7Sn9.3P6.5 filler metal. International journal of simulation, science, system and technology. 2014; 17(24): 1473-8031.

Zhang PL, Yao S, Ding M, Lu FG, Lou SN. Microstructural analysis in the vacuum brazing of copper to copper using a phosphor-copper brazing filler metal. International Journal of Materials Research. 2010; 101(11): 1436-144.

SH Chen, LQ Li, YB Chen. Joining mechanism of Ti/Al dissimilar alloys during laser welding-brazing process. Journal of alloys and compounds. 2011; 509(01): 891-8.

XG Song, J Cao, HY Chen. Contact reactive brazing of Ti53311S alloy using Cu foil as interlayer: Interfacial microstructure and joining properties. Materials and Design. 2013; 4(04): 895-901.

WQ Yang, TS Lin, P He. Microstructure and mechanical properties of ZrB2–SiC joints fabricated by a contact-reactive brazing technique with Ti and Ni interlayers. Ceramics International. 2014; 40(06):7253-60.

Li Yi-nan, Wang Chang-wen, Peng Zi-long, Yan Jiu-chun, Liu Xue-song. Dissolution behaviour of Cu in Cu-Ag and Cu-P brazing alloys using weld brazing. Transactions of Nonferrous Metals Society of China. 2011; 2(21): 394-399.

Lee HT, Chen MH. Influence of intermetallic compounds on the adhesive strength of solder joints. Material science engineering A – Structure material properties microstructure processing. 2002; 333: 24–34.

Prakash KH, Sritharan T. Tensile fracture of tin-lead solder joints in copper. Material Science Engineering A – Structure material properties microstructure processing. 2004; 379: 277–85.

Lee HT, Chen MH, Jao HM, Liao TL. Influence of interfacial intermetallic compound on fracture behaviour of solder joints. Material Science Engineering A – Structure material properties microstructure processing. 2003; 358: 134–41.

Zhao J, Cheng CQ, Qi L, Chi CY. Kinetics of intermetallic compound layers and shear strength in Bi-bearing SnAgCu/Cu soldering couples. Journal Alloys Compound. 2009; 73: 382–8.

Liu P, Yao P, Liu J. Effects of multiple reflows on interfacial reaction and shear strength of SnAgCu and SnPb solder joints with different PCB surface finishes. Journal Applied Physics. 2009; 470: 188–94.

Hayes SM, Chawla N, Frear DR. Interfacial fracture toughness of Pb-free solders. Microelectronics reliability. 2009; 49: 269–87.

Tong An, Fei Qin. Effect of the intermetallic compound microstructure on the tensile behaviour of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates. Microelectronics reliability. 2014; 54: 932-938.

WNWMN Hissyam, AM Halil, T Kurniawan, M Ishak and T Ariga. Effect of copper based filler composition on spreading and wetting behaviour. Material and Science Engineering. 2017; 238: 012020.

Downloads

Published

2019-06-28

How to Cite

[1]
A. J. Sulaiman H., W. N. W. M. N. Hissyam, A. M. H., M. Ishak, and T. Ariga, “Effect of copper based filler composition on the strength of brazed joint”, J. Mech. Eng. Sci., vol. 13, no. 2, pp. 5090–5103, Jun. 2019.