Finite element modelling of thin intermetallic compound layer fractures

Authors

  • Ooi Eang Pang Fracture and Damage Mechanic SIG, School of Mechatronic Engineering, University Malaysia Perlis 02600, Arau, Perlis, Malaysia
  • Ruslizam Daud Fracture and Damage Mechanic SIG, School of Mechatronic Engineering, University Malaysia Perlis 02600, Arau, Perlis, Malaysia
  • Nasrul Amri Mohd Amin Fracture and Damage Mechanic SIG, School of Mechatronic Engineering, University Malaysia Perlis 02600, Arau, Perlis, Malaysia
  • Mohd Afendi Rojan Fracture and Damage Mechanic SIG, School of Mechatronic Engineering, University Malaysia Perlis 02600, Arau, Perlis, Malaysia
  • Mohd Shukry Abd Majid Fracture and Damage Mechanic SIG, School of Mechatronic Engineering, University Malaysia Perlis 02600, Arau, Perlis, Malaysia

DOI:

https://doi.org/10.15282/jmes.11.1.2017.7.0228

Keywords:

: Intermetallic compound; solder ball joint; stress intensity factor; finite element analysis.

Abstract

A thin intermetallic compound (IMC) of solder ball joint induces strong stress concentration between the pad and solder where a crack propagated near the IMC layer. The fracture mechanism of the IMC layer is complex due to the effect of IMC thickness, crack length, solder thickness and Young’s Modulus. At present, there is still an undefined exact geometrical model correlation for numerical simulations of IMC layer fracture. Thus, this paper aims to determine the accuracy of IMC layer models subjected to crack-to-width length ratio (a/W) in correlation with the ASTM E399-83 Srawley compact specimen model using finite element (FE) analysis. Several FE models with different geometrical configurations have been proposed under 10 MPa tensile loading. In this study, the two dimensional linear elastic displacement extrapolation method (DEM) is formulated to calculate the stress intensity factor (SIF) at the crack tip. The study showed that with an error of 0.58% to 0.59%, a width of 2.1 mm and a height of 1.47 mm can be recommended as the best geometrical model for IMC layer fracture modelling which provides a wider range for a/W from 0.45 to 0.85 instead of from 0.45 to 0.55. This result is significant as it presents a method for determining fracture parameters at thin IMC layers with a combination of singular elements with meshes at different densities which is tailored to the Srawley model.

References

Tian Y, Hang C, Wang C, Yang S, Lin P. Effects of bump size on deformation and fracture behavior of sn3. 0ag0. 5cu/cu solder joints during shear testing. Materials Science and Engineering: A. 2011;529:468-78.

Le V-N, Benabou L, Tao Q-B, Etgens V. Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module. International Journal of Solids and Structures. 2017;106:1-12.

Yao Y, Keer LM, Fine ME. Modeling the failure of intermetallic/solder interfaces. Intermetallics. 2010;18:1603-11.

Azmah Hanim MA, Ourdjini A, Saliza Azlina O, Siti Rabiatul Aisha I. Intermetallic evolution for isothermal aging up to 2000 hours on sn-4ag-0.5cu and sn-37pb solders with ni/au layers. International Journal of Automotive and Mechanical Engineering. 2013;8:1348-56.

Azmah Hanim MA, Ourdjini A, Siti Rabiatull Aisha I, Saliza Azlina O. Thermal cyclic test for sn-4ag-0.5cu solders on high p ni/au and ni/pd/au surface finishes. Journal of Mechanical Engineering and Sciences. 2015;9:1571-9.

Nadimpalli SP, Spelt JK. Effect of geometry on the fracture behavior of lead-free solder joints. Engineering Fracture Mechanics. 2011;78:1169-81.

Shen YL, Aluru K. Numerical study of ductile failure morphology in solder joints under fast loading conditions. Microelectronics Reliability. 2010;50:2059-70.

Aluru K, Wen FL, Shen YL. Direct simulation of fatigue failure in solder joints during cyclic shear. Materials & Design. 2011;32:1940-7.

Lee JH, Jeong HY. Fatigue life prediction of solder joints with consideration of frequency, temperature and cracking energy density. International Journal of Fatigue. 2014;61:264-70.

Nadimpalli SP, Spelt JK. Mixed-mode fracture load prediction in lead-free solder joints. Engineering Fracture Mechanics. 2011;78:317-33.

Alam M, Lu H, Bailey C, Chan YC. Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science. 2009;45:576-83.

Amalu EH, Ekere NN. High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology. 2012;212:471-83.

ASTM-E399-83. Standard test method for plane strain fracture toughness testing of metallic materials. . ASTM Annual Book of Standards, Section 2. 1992;3:1-31.

Srawley JE. Wide range stress intensity factor expressions for astm e 399 standard fracture toughness specimens. International journal of fracture. 1976;12:475-6.

Vashishth D, Behiri JC, Bonfield W. Crack growth resistance in cortical bone: Concept of microcrack toughening. Journal of Biomechanics. 1997;30:763-9.

Zhu W, Smith D. On the use of displacement extrapolation to obtain crack tip singular stresses and stress intensity factors. Engineering Fracture Mechanics. 1995;51:391-400.

Tracey DM. Finite elements for determination of crack tip elastic stress intensity factors. Engineering Fracture Mechanics. 1971;3:255-65.

Mohamed MA, Manurung YHP, Ghazali FA, Karim AA. Finite element-based fatigue life prediction of a load-carrying cruciform joint. Journal of Mechanical Engineering and Sciences. 2015;8:1414-25.

Zulkifli A, Ariffin AK, Rahman MM. Probabilistic finite element analysis on vertebra lumbar spine under hyperextension loading. International Journal of Automotive and Mechanical Engineering. 2011;3:256-64.

Zhu WX, Smith DJ. On the use of displacement extrapolation to obtain crack tip singular stresses and stress intensity factors. Engineering Fracture Mechanics. 1995;51:391-400.

Chan SK, Tuba IS, Wilson WK. On the finite element method in linear fracture mechanics. Engineering Fracture Mechanics. 1970;2:1-17.

Sinclair GB, Meda G, Smallwood BS. On crack-tip stresses as crack-tip radii decrease. Journal of Applied Mechanics. 2011;78:011004.

Gu GX, Dimas L, Qin Z, Buehler MJ. Optimization of composite fracture properties: Method, validation, and applications. Journal of Applied Mechanics. 2016;83:071006.

Jen YM, Chiou YC, Yu CL. Fracture mechanics study on the intermetallic compound cracks for the solder joints of electronic packages. Engineering Failure Analysis. 2011;18:797-810.

Daud R, Ariffin AK, Abdullah S. Validation of crack interaction limit model for parallel edge cracks using two-dimensional finite element analysis. International Journal of Automotive and Mechanical Engineering. 2013;7:993-1004.

Anderson TL. Fracture mechanics: Fundamentals and applications: CRC press; 2017.

Bhate D, Subbarayan G, Nguyen L, Zhao J. Singularities at solder joint interfaces and their effects on fracture models: Part i. IEEE 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. p. 738-45.

Downloads

Published

2017-03-31

How to Cite

[1]
Ooi Eang Pang, Ruslizam Daud, Nasrul Amri Mohd Amin, Mohd Afendi Rojan, and Mohd Shukry Abd Majid, “Finite element modelling of thin intermetallic compound layer fractures”, J. Mech. Eng. Sci., vol. 11, no. 1, pp. 2478–2487, Mar. 2017.

Issue

Vol. 11 No. 1 (2017): March 2017

Section

Article

License

Copyright (c) 2017 The Author(s)

Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.