The dependency of the microhardnes on microstructure and solidification parameters of directionally solidified Al–4.5wt.%Cu in clay mold

Authors

  • Dedy Masnur Mechanical and Industrial Engineering Department, Universitas Gadjah Mada, Jl. Grafika No. 2, Yogyakarta 55281, Indonesia
  • Viktor Malau Mechanical and Industrial Engineering Department, Universitas Gadjah Mada, Jl. Grafika No. 2, Yogyakarta 55281, Indonesia
  • Suyitno Suyitno Mechanical and Industrial Engineering Department, Universitas Gadjah Mada, Jl. Grafika No. 2, Yogyakarta 55281, Indonesia

DOI:

https://doi.org/10.15282/jmes.14.3.2020.13.0558

Keywords:

Al-Cu, unidirectional solidification, microstructure, clay mold, micro-hardness

Abstract

Improvement of material properties is achieved by controlling parameters involved in the solidification process; therefore, understanding them and their implication are essential. This work investigated the dependency of solidification parameters (cooling rate (TR), growth rate (VL), local solidification time (tSL), temperature gradient (G)), microstructure parameters (primary (λ1) and secondary (λ2) dendrite arm spacing), and micro-hardness values (HV) of Al-4.5wt.%Cu in the clay mold. The samples were directionally solidified in Bridgman vertical apparatus and the temperature is recorded during the cooling. The solidification parameters were obtained from the cooling curve. The microstructures and micro-hardness were characterized using an optical microscope and micro-hardness tester. The microstructure parameters were measured and plotted as functions of solidification parameters using linear regression. The relation between HV and microstructure parameters are analyzed. The results show the λ1 and λ2 change inversely with solidification parameters except for tSL. Comparison to other works shows the exponent values of solidification parameters of the clay mold are lower than that of the carbon and stainless-steel mold. The exponent value of λ2 in the clay mold is -0.183, close to the value in the graphite mold. The clay has the potential as mold material since it characteristic close to the graphite.

References

S. R. Pedapati, D. Paramaguru, M. Awang, H. Mohebbi, and S. Korada, "Effect of process parameters on mechanical properties of AA5052 joints using underwater friction stir welding," J. Mech. Eng. Sci., vol. 14, no. 1, pp. 6259 - 6271, 2020.

R. Kaufman, “Aluminum Alloy Castings: Properties, Processes, and Applications,” in Elsevier Science, 2004.

A. J. Sulaiman H., W. N. W. M. N. Hissyam, A. M. H., M. Ishak, and T. Ariga, “Effect of copper based filler composition on the strength of brazed joint," J. Mech. Eng. Sci, vol. 13, no. 2, pp. 5090 - 5103, 2019.

ASM International Handbook Committee, “Properties and selection--nonferrous alloys and special-purpose materials,” in ASM International Vol 2. 2001.

J. E. Spinelli, D. M. Rosa, I. L. Ferreira, A. Garcia, “Influence of melt convection on dendritic spacings of downward unsteady-state directionally solidified Al–Cu alloys,” Mater. Sci. Eng. A, vol. 383, no. 2, pp. 271 - 282, 2004.

E. C. Araújo et al., “The Role of Si and Cu Alloying Elements on the Dendritic Growth and Microhardness in Horizontally Solidified Binary and Multicomponent Aluminum-Based Alloys,” Metall. Mater. Trans. A, vol. 48A, pp. 1163 - 1175, 2017.

E. Çadirli E. “Effect of solidification parameters on mechanical properties of directionally solidified Al-Rich Al-Cu alloys, ” Met. Mater. Int., vol. 19, no. 3, pp. 411 - 422, 2013.

T. A. Costa et al. “Growth direction and Si alloying affecting directionally solidified structures of Al–Cu–Si alloys,” Mater. Sci. Technol., vol. 31, no. 9, pp. 1103 - 1112, 2014.

O. L. Rocha, C. A. Siqueira, A. Garcia, “Heat flow parameters affecting dendrite spacings during unsteady-state solidification of Sn-Pb and Al-Cu alloys, ” Metall. Mater. Trans. A, vo. 34, no. 4, pp. 995 - 1006, 2003.

S. Slamet, S., and I. Kusumaningtyas, “Effect of composition and pouring temperature of Cu(20-24)wt.%Sn by sand casting on fluidity and mechanical properties”, J. Mech. Eng. Sci, vol. 13, no. 4, pp. 6022-6035, 2019.

D. Masnur, Suyitno and V. Malau, “The Influence of Mold Material on Cooling Curve, Solidification Parameters, and Micro-hardness of Al–6wt .% Si in Unidirectional Solidification,” IOP Conf. Ser. Mater. Sci. Eng., pp. 547, 2019.

S. Shariza, T. J. S. Anand, A. R. M. Warikh, L. C. Chia, C. K. Yau, L. B. Huat, "Bond strength evaluation of heat treated Cu-Al wire bonding," J. Mech. Eng. Sci. vol. 12, no. 4, pp. 4275 - 4284, 2018.

ASM International. "Alloy Phase Diagrams," in ASM Handbook, Volume 3, 2004.

D. Eskin, Q. Du, D. Ruvalcaba and L. Katgerman, "Experimental study of structure formation in binary Al-Cu alloys at different cooling rate," Mater. Sci. Eng. A, vo. 405, pp. 1 - 10, 2005.

W. Desrosin, L. Boycho, V. Scheiber, C. M. Méndez, C. E. Schvezov, A. E. Ares. "Evolution of Metallographic Parameters during Horizontal Unidirectional Solidification of Zn-Sn Alloys," Procedia Mater. Sci., vol. 8, pp. 968 - 977, 2015.

D. H. Askeland, P. P. Fulay, "Materials Science and Engineering 2nd Editions," in Cengage Learning, 2009.

H. Kaya, U. Böyük, E. Çadirli and N. Maraşli, "Influence of growth rate on microstructure, microhardness, and electrical resistivity of directionally solidified Al-7 wt% Ni hypo-eutectic alloy," Met. Mater. Int. vol. 19, no. 1, pp. 39 - 44, 2013.

T. Chen, X. Li, H. Guo and Y. Hao, "Microstructure and crystal growth direction of Al−Cu alloy," Trans Nonferrous Met. Soc. China. vol. 25, no. 5, pp. 1399 - 1409, 2015.

ASTM Int., "ASTM E384: Standard Test Method for Knoop and Vickers Hardness of Materials," in ASTM Stand. 2012.

W. D. Griffiths, "Heat-transfer coefficient during the unidirectional solidification of an Al-Si alloy casting," Met. Mater. Trans B. vol. 30, no. 3, pp. 473 - 482, 1999.

T. L. Bergman, A. S. Lavine, F. P. Incropere and D. P. DeWitt, "Fundamentals of Heat and Mass Transfer," in John Wiley & Sons, Inc., 2011.

S. Engin, U. Büyük and N. Maraşli, "The effects of microstructure and growth rate on microhardness, tensile strength, and electrical resistivity for directionally solidified Al-Ni-Fe alloys," J. Alloys Compd.. vol. 660, pp. 23 - 31, 2016.

A. Aker and H. Kaya, "Measurements of microstructural, mechanical, electrical, and thermal properties of an Al-Ni Alloy," Int. J. Thermophys. vol. 34, no. 2, pp. 267 - 283, 2013.

H. Kaya, U. Böyük, E. Çadirli E and N. Maraşli, "Measurements of the microhardness, electrical and thermal properties of the Al-Ni eutectic alloy," Mater. Des., vol. 34, pp: 707 - 712, 2012.

H. Kaya, U. Büyük, E. Çadırlı and N. M. Yildiz, "Influence of growth rate on microstructure, microhardness, and electrical resistivity of directionally solidified Al-7 wt% Ni Hypo-Eutectic Alloy," Met. Mater. Int., vol. 19, pp: 39 - 44, 2013.

A. Hiremath, A. AmarMurthy, S. V. Pranavathmaja, A. Jajodia and R. Sreenath, "Effect of end chills, reinforcement content and carburization on the hardness of LM25-borosilicate glass particulate composite," J. Mech. Eng. Sci. vol. 12, no. 4, pp. 4203 - 4215, 2018.

K. S. Cruz, I. L. Ferreira, J. E. Spinelli, N. Cheung and A. Garcia, "Inverse segregation during transient directional solidification of an Al – Sn alloy : Numerical and experimental analysis," Mat. Chem. Phy. vol. 115, pp. 116 - 121, 2009.

M. C. Flemmings, "Solidification Processing" in New York: McGraw-Hill, 1974.

I. L. Ferreira, C. A. Santos, V. Voller and A. Garcia, "Analytical , Numerical , and Experimental Analysis of Inverse Macrosegregation during Upward Unidirectional Solidification of Al-Cu Alloys," Met. Mater. Trans B. vo. 35, pp. 285 - 297, 2004.

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Published

2020-09-29

How to Cite

[1]
D. Masnur, V. Malau, and S. Suyitno, “The dependency of the microhardnes on microstructure and solidification parameters of directionally solidified Al–4.5wt.%Cu in clay mold”, J. Mech. Eng. Sci., vol. 14, no. 3, pp. 7125–7131, Sep. 2020.

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