Mechanical Analysis and Constitutive Modeling of Nonlinear Behavior of Silver-based Conductive Ink
Keywords:Conductive ink, Tensile testing, Elastic-plastic modelling , FE analysis, Nanoindentation test
Stretchable electronic devices are progressively deployed in many applications of mechanical, electrical, and bio-medical engineering. These circuits are made of stretchable and flexible substrate, as well as conductive ink, and various electronic components. The choice of components and layouts for the substrate and conductive ink can regulate the stretchability of stretchable circuits. On top of that, the substance utilized to create the conductive ink must have high electrical conductivity and strong adherence to the substrate in order to produce a high-quality stretchable printed circuit. Thus, this study focused on the development of stretchable conductive ink using silver powder as a conductive filler and PDMS-OH as a binder. The mechanical properties of the synthesized ink were investigated via simple uniaxial tensile testing method and nanoindentation technique, respectively. Accordingly, the modulus of elasticity, tensile stress and yield stress of the ink were obtained as 5.72 MPa, 1.195 MPa, and 0.86 MPa, congruently at 137% strain before undergoing failure. The experimental stress-strain data was then employed on the elastic-plastic constitutive model to investigate the elastomeric properties of the ink as it is an alternative method of lengthy and expensive procedures of validating different polymers. Moreover, the hardness and reduced modulus of the ink were evaluated by nanoindentation method using 5 mN maximum load with 0.5 mN/s loading/unloading rate and 2 secs holding time. Consequently, the hardness and reduced modulus values were obtained as 1.45 MPa and 34.53 MPa, respectively. These values were further validated by Oliver-Pharr method, and were in a good agreement.
How to Cite
Copyright (c) 2023 Universiti Malaysia Pahang Publishing
This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.