A two degrees of freedom comb capacitive-type accelerometer with low cross-axis sensitivity
DOI:
https://doi.org/10.15282/jmes.13.3.2019.09.0435Keywords:
Comb capacitive-type accelerometer, SOI-micromachining, folded-beam spring, cross-axis sensitivityAbstract
In this paper, we report on a SOI-based comb capacitive-type accelerometer that senses acceleration in two lateral directions. The structure of the accelerometer was designed using a proof mass connected by four folded-beam springs, which are compliant to inertial displacement causing by attached acceleration in the two lateral directions. At the same time, the folded-beam springs enabled to suppress cross-talk causing by mechanical coupling from parasitic vibration modes. The differential capacitor sense structure was employed to eliminate common mode effects. The design of gap between comb fingers was also analyzed to find an optimally sensing comb electrode structure. The design of the accelerometer was carried out using the finite element analysis. The fabrication of the device was based on SOI-micromachining. The characteristics of the accelerometer have been investigated by a fully differential capacitive bridge interface using a sub-fF switched-capacitor integrator circuit. The sensitivities of the accelerometer in the two lateral directions were determined to be 6 and 5.5 fF/g, respectively. The cross-axis sensitivities of the accelerometer were less than 5%, which shows that the accelerometer can be used for measuring precisely acceleration in the two lateral directions. The accelerometer operates linearly in the range of investigated acceleration from 0 to 4g. The proposed accelerometer is expected for low-g applications.
References
Chau KHL, Lewis SR, Zhao Y, Howe RT, Bart SF, Marcheselli RG. An integrated force-balanced capacitive accelerometer for low-g applications. Sensors and Actuatuator A: Physical. 1996; 54: 472-476.
Dong J, Li X, Wang Y, Lu D, Ahat S. Silicon micromachined shock accelerometers with a curved-surface-application structure for over-range stop protection and free-mode-resonance depression. Journal of Micromechanics and Microengineering. 2002; 12: 742-746.
Bouten CVC, Koekkoek KTM, Verduin M, Kodde L, Janssen JD. A triaxial accelerometer and portable data processing unit for the assessment of daily physical activity. IEEE Transactions on Biomedical Engineering. 1997; 44(3): 136-147.
Roy AL, Bhattacharyya TK. Design, fabrication and characterization of high performance SOI MEMS piezoresistive accelerometers. Microsystem Technologies. 2015; 21(1): 55-63.
Tian B, Liu H, Yang N, Zhao Y, Jiang Z. Design of a Piezoelectric Accelerometer with High Sensitivity and Low Transverse Effect. Sensors. 2016; 16(10): 1587-1593.
Chu CL, Lin CH, Fan KC. Two-dimensional optical accelerometer based on commercial DVD pick-up head. Measurement Science and Technology. 2007; 18: 265-274.
Antunes P, Varum H, André P. Uniaxial fiber Bragg grating accelerometer system with temperature and cross axis insensitivity. Measurement. 2011; 44: 55-59.
Kumar KS, Swamy KBM, Mukherjee B, Sen S. Testing of MEMS capacitive accelerometer structure through electro-static actuation. Microsystem Technologies. 2013; 19: 79-87.
Aaltonen L, Halonen K. Continuous-time interface for a micromachined capacitive accelerometer with NEA of 4 µg and bandwidth of 300 Hz. Sensors and Actuatuator A: Physical. 2009; 154(1): 46-56.
Linxi D, Yongjie L, Haixia Y, Lingling S. Characteristics of a novel biaxial capacitive MEMS accelerometer. Journal of Semiconductor. 2010; 31(5): 054006.
Mistry KK, Swamy KBM, Sen S. Design of an SOI-MEMS high resolution capacitive type single axis accelerometer. Microsystem Technologies. 2010; 16: 2057-66.
Zou X, Che L, Wu J, Li X, Wang Y. A novel sandwich capacitive accelerometer with a symmetrical structure fabricated from a D-SOI wafer. Journal of Micromechanics and Microengineering. 2012; 22(8): 085031.
Yubin J, Yilong H, Rong Z. Bulk silicon resonant accelerometer. Chinese Journal of Semiconductors. 2005; 26 (2): 281-286.
Kumar KS, Chatterjee P, Mukherjee B, Swamy KBM, Sen S. A Differential Output Interfacing ASIC for Integrated Capacitive Sensors. IEEE Transactions on Instrumentation and Measurement. 2018; 67(1): 196-203.
Tirupathi R, Kumar KS. A Differential Output Switched Capacitor based Capacitive Sensor Interfacing Circuit. IEEE TENCON 2018: 2018 IEEE Region 10 Conference. 2018; 0565-0569.
Amini BV, Abdolvand R, Ayazi F. A 4.5-mW Closed-Loop ∑Δ Micro-Gravity CMOS SOI Accelerometer. IEEE Journal of Solid-State Circuits. 2006; 41: 2983-2991.
Zhou X, Che L, Wu J, Li X, Wang Y. A novel sandwich capacitive accelerometer with a symmetrical structure fabricated from a D-SOI wafer. Journal of Micromechanics and Microengineering. 2012; 22(8): 085031.
Tseng SH, Lu MSC, Wu PC, Teng YC, Tsai HH, Juang YZ. Implementation of a monolithic capacitive accelerometer in a wafer-level 0.18 µm CMOS MEMS process. Journal of Micromechanics and Microengineering. 2012; 22(5): 055010.
Matsumoto Y, Nishimura M, Matsuura M, Ishida M. Three-axis SOI capacitive accelerometer with PLL C-V converter. Sensors and Actuatuator A: Physical. 1999; 75: 77-85.
Lee JS, Lee SS. An isotropic suspension system for a biaxial accelerometer using electroplated thick metal with a HAR SU-8 mold. Journal of Micromechanics and Microengineering. 2008; 18(2): 025036.
Xie J, Agarwal R., Liu Y, Tsai JM, Ranganathan N. Compact electrode design for an in-plane accelerometer on SOI with refilled isolation trench. Proceeding Transducers’ 11. 2011; 76.
Weinberg MS, Kourepenis A. Error sources in in-plane silicon tuningfork MEMS gyroscopes. Journal of Micromechanics and Microengineering. 2006; 15: 479-491.
Madou MJ. Fundamentals of Microfabrication, CRC Press, Boca Raton, FL.1997; 145-160 and 464-468.
Zhang X, Tang WC. Viscous air damping in laterally driven microresonators. Proceeding IEEE MEMS. 1994; 199-204.
Jono K, Hashimoto M, Esashi M. Electrostatic servo system for multi-axis accelerometers. Proceeding IEEE MEMS. 1994; 251-256.
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