Deformation mechanics of sputtered copper layers during nanoindentation tests

  • M. A. A. Afripin School of Mechanical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia, 81310 Johor Bahru, Malaysia.
  • N. A. Fadil School of Mechanical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia, 81310 Johor Bahru, Malaysia.
  • M. Nasir Tamin Faculty of Mechanical Engineering, Universiti Teknologi Malaysia, Johor Bahru, Malaysia.
Keywords: Hardening curve, hardness, nanoindentation test, sputtered copper coating, Young’s modulus

Abstract

The mechanical properties of the thin sputtered copper layer on the SiO2-coated silicon substrate is needed as part of the requirements in quantifying the reliability of the Through-Silicon Via (TSV) interconnects. In this respect, two different Cu coating layers, each from the different sputtering process, are examined. A series of nanoindentation tests are performed on the Cu coating layer samples with indenter speeds ranging from 80 to 400 nm/s, and the indentation depths of 320 nm. The properties of elastic modulus, hardness and the hardening behavior of the Cu coating layers have been quantified. Results show that the coating with higher contamination of C at 8.41 wt. % displays a significant hardening and a peak load level, as reflected in the measured nanoindentation load-displacement curves. However, insignificant effect of the applied probe displacement speeds up to 400 nm/s on the resulting properties of the coating is registered. The Johnson-Cook constitutive equation adequately describes the strain rate-dependent hardening behavior of the Cu coating layer.

Published
2020-03-23
How to Cite
Afripin, M. A. A., Fadil, N. A., & Tamin, M. N. (2020). Deformation mechanics of sputtered copper layers during nanoindentation tests. Journal of Mechanical Engineering and Sciences, 14(1), 6504 - 6513. https://doi.org/10.15282/jmes.14.1.2020.25.0510
Section
Article