Experimental investigation on microgrooving characteristics of ceramics using electroplated diamond wire tools

Satoshi Sakamoto; J. Liu; M. Gemma; T. Yakou

doi:10.15282/jmes.16.2.2022.02.0698

Authors

S. Sakamoto College of Education, Yokohama National University, 79-2 Tokiwadai, Hodogaya-ku, Yokohama, 240-8502, Japan. Phone and Fax: +81-45-339-3461.
J. Liu Semiconductor Department, TDI Product Solution Company, 2-30-17 Higashi-hashimoto, Midori-ku, Sagamihara, 252-0144, Japan.
M. Gemma Department of Technology education, Keio Futsubu School, 1-45-1 Hiyoshi-honcho, Kohoku-ku, Yokohama, 223-0062, Japan.
T. Yakou School of Engineering, Tokyo Denki University, 5 Senju Asahi-cho, Adachi-ku, Tokyo, 120-8551, Japan.

DOI:

https://doi.org/10.15282/jmes.16.2.2022.02.0698

Keywords:

Microgrooving, Wire tool, Tool wear, Ceramics, Material properties

Abstract

For precision machining such as slicing and grooving of hard and brittle materials, wire tools with electroplated diamond abrasives have been widely used. Slicing with electroplated diamond wire tools, in particular, is quickly becoming a common method for machining hard materials. Many studies have been published on the machining properties of electroplated diamond wire tools. However, there are very few reports on the tool wear of wire tools. In particular, the influence of work material on the machining and wear characteristics of electroplated diamond wire tools is still unclear. Fundamental grooving experiments are used to investigate the effect of the workpiece’s material properties on the grooving characteristics and the wear characteristics of the wire tool. Two types of ceramics, alumina (Al₂O₃) and zirconia (ZrO₂), were used as work materials in this study. The grooving experiments revealed that the workpiece material affects the machining characteristics. Alumina, which is brittle, was found to be more machinable than zirconia, which has a high toughness for the same hardness. The wear of the electroplated diamond wire tools, on the other hand, showed no significant difference.

References

H. Wu, “Wire sawing technology: A state-of-the-art review,” Precis. Eng., vol. 43, pp. 1-9, 2016.

H. Suwabe, “Improvement of multi-wire saw and ductile mode slicing,” J. Jpn. Soc. Precis., vol. 83, no. 9, pp. 815-819, 2017.

M. Ge, et al., “Fabrication of thin resin-bonded diamond wire and its application to ductile-mode wire sawing of mono-crystalline silicon,” Mater. Sci. Semicond. Process., vol. 126, p. 105665, 2021.

C. W. Hardin et al., “Fixed abrasive diamond wire saw slicing of single-crystal silicon carbide wafers,” Mater. Manuf. Processes, vol. 19, no. 2, pp. 355-367, 2004.

Y. Gao and Y. Chen, “Sawing stress of SiC single crystal with void defect in diamond wire saw slicing,” Int. J. Adv. Manuf. Technol., vol. 103, no. 1-4, pp. 1019-1031, 2019,

T. Suzuki et al., “Mechanisms of material removal and subsurface damage in fixed-abrasive diamond wire slicing of single-crystalline silicon,” Precis. Eng., vol. 50, pp. 32-43, 2017.

T. Suzuki et al., “Improved adherence strength between diamond grains and electrolytic nickel bonds by carbon nanotube coatings,” J. Solid Mech. Mater. Eng., vol. 5, no. 8, pp. 386-396, 2011.

J. Muraoka and T. Suzuki, “Slicing of monocrystalline Si using high bonding electroplated diamond wires by carbon nanotube composite electroplating,” JSPE Spring Meet., p. 625, 2016.

U. Pala et al., “Experimental investigation of tool wear in electroplated diamond wire sawing of silicon,” Procedia CIRP, vol. 77, pp. 371-374, 2018.

S. Sakamoto et al., “L-shaped machining of anisotropic woods with a fine wire cutting tool,” Key Eng. Mater., vol. 656-657, pp. 314-319, 2015.

S. Sakamoto et al., “Sliced surface generation mechanism of unidirectional glass fiber-reinforced plastic by multi-wire sawing,” Int. J. Mech. Eng. Robot. Res., 835-840, 2020.

S. Sakamoto et al., “Surface characteristics produced by multi-wire sawing of GFRP,” Key Eng. Mater., vol. 625, pp. 597-602, 2015.

S. Sakamoto et al., “The wear characteristics of a wire tool in the micro-grooving of ceramics,” Key Eng. Mater., vol. 719, pp. 132-136, 2017.

S. Sakamoto et al., “Influence of the characteristics of a workpiece on the slicing characteristics including tool wear,” MATEC Web Conf., vol. 221, p. 04005, 2018.

M. Gemma et al., “Influence of the material properties on micro-grooving using wire tools electro-deposited with diamond grains,” Int. J. Eng. Adv. Technol., vol. 11, no. 1, pp. 155-161, 2021.

T. Sugita et al., Machining of Ceramics. Tokyo, Japan: Yokendo Co, Ltd., 1985.

S. Sakamoto et al., “Influence of the brittle behavior of work materials on polishing characteristics,” IOP Conf. Ser. Mater. Sci. Eng., vol. 229, p. 012031, 2017.