Interaction effects of silica incorporation and processing parameters on dielectric loss in pineapple leaf-epoxy composites at 5 GHz
DOI:
https://doi.org/10.15282/Keywords:
Bio-based dielectric composite, Natural fiber composite, Microwave substrate, Loss tangent, Two-level factorial analysisAbstract
Bio-based dielectric composites have attracted increasing interest as sustainable substitutes for conventional microwave materials, but controlling dielectric loss through the interplay of processing and formulation parameters is still a significant challenge. This work studies the interaction effects of silica addition and processing parameters on the dielectric properties of pineapple leaf-epoxy composites at 5 GHz. The effects of volume of sodium hydroxide solution, soaking time, silica loading, and pineapple leaf fiber powder loading were evaluated using a two-level factorial analysis. Dielectric characterization was performed using a vector network analyzer and a rectangular waveguide. The loss tangent values of the resulting composites were 0.00959 to 0.05894, and the permittivity values were 2.83 to 3.39. The analysis of variance confirmed the statistical significance of the developed factorial model (p = 0.0064) with an adjusted R² of 0.9999. Additionally, the formulated compositions investigated, the smallest loss tangent of 9.59122×10-3 was obtained using 450 mL sodium hydroxide solution, 30 min soaking time, 4 g silica loading, and 30 g pineapple leaf fiber powder loading. The results suggest that the dielectric performance of pineapple leaf-epoxy composites is controlled by the interplay of processing conditions and material formulation, providing therefore a systematic framework for the development of sustainable dielectric materials for microwave substrate applications.
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