HUSSIN, N.F.R.; ROSLI, N. Study of Underfill Flow in Microchip Packaging Using Ansys. Journal of Modern Manufacturing Systems and Technology, [S. l.], v. 6, n. 2, p. 76–82, 2022. DOI: 10.15282/jmmst.v6i2.8571. Disponível em: https://journal.ump.edu.my/jmmst/article/view/8571. Acesso em: 23 nov. 2024.