W. Fong, K.L. Koay, I.A. Azid. Experimental evaluation on the silicon mechanical performance of electronic packaging. J. Mech. Eng. Sci. [Internet]. 2017 Mar. 31 [cited 2024 May 18];11(1):2456-68. Available from: https://journal.ump.edu.my/jmes/article/view/7991