Asasaari SF, Fadil NA, Tamin MN. Mechanics of solder/IMC interface of lead-free solder interconnects in ball grid array assembly. J. Mech. Eng. Sci. [Internet]. 2022 Mar. 23 [cited 2024 Nov. 22];16(1):8718-29. Available from: https://journal.ump.edu.my/jmes/article/view/6788