Azmah Hanim M, Ourdjini A, Siti Rabiatull Aisha I, Saliza Azlina O. Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishe. J. Mech. Eng. Sci. [Internet]. 2015 Dec. 31 [cited 2024 Nov. 22];9:1572-9. Available from: https://journal.ump.edu.my/jmes/article/view/8323