Asasaari, Siti Faizah, Nor Akmal Fadil, and Mohd Nasir Tamin. “Mechanics of solder/IMC Interface of Lead-Free Solder Interconnects in Ball Grid Array Assembly”. Journal of Mechanical Engineering and Sciences 16, no. 1 (March 23, 2022): 8718–8729. Accessed April 25, 2024. https://journal.ump.edu.my/jmes/article/view/6788.