W. Fong, K.L. Koay, and I.A. Azid. “Experimental Evaluation on the Silicon Mechanical Performance of Electronic Packaging”. Journal of Mechanical Engineering and Sciences 11, no. 1 (March 31, 2017): 2456–2468. Accessed November 22, 2024. https://journal.ump.edu.my/jmes/article/view/7991.