Shariza, S., T. Joseph Sahaya Anand, A. R. M. Warikh, Lee Cher Chia, Chua Kok Yau, and Lim Boon Huat. “Bond Strength Evaluation of Heat Treated Cu-Al Wire Bonding”. Journal of Mechanical Engineering and Sciences 12, no. 4 (December 27, 2018): 4275–4284. Accessed November 24, 2024. https://journal.ump.edu.my/jmes/article/view/382.