Shariza, S., Anand, T. J. S., Warikh, A. R. M., Cher Chia, L., Kok Yau, C. and Boon Huat, L. (2018) “Bond strength evaluation of heat treated Cu-Al wire bonding”, Journal of Mechanical Engineering and Sciences, 12(4), pp. 4275–4284. doi: 10.15282/jmes.12.4.2018.21.0367.