W. FONG; K.L. KOAY; I.A. AZID. Experimental evaluation on the silicon mechanical performance of electronic packaging. Journal of Mechanical Engineering and Sciences, [S. l.], v. 11, n. 1, p. 2456–2468, 2017. DOI: 10.15282/jmes.11.1.2017.5.0226. Disponível em: https://journal.ump.edu.my/jmes/article/view/7991. Acesso em: 18 may. 2024.