ASASAARI, S. F.; FADIL, N. A.; TAMIN, M. N. Mechanics of solder/IMC interface of lead-free solder interconnects in ball grid array assembly. Journal of Mechanical Engineering and Sciences, [S. l.], v. 16, n. 1, p. 8718–8729, 2022. DOI: 10.15282/jmes.16.1.2022.06.0689. Disponível em: https://journal.ump.edu.my/jmes/article/view/6788. Acesso em: 19 apr. 2024.