SHARIZA, S.; ANAND, T. Joseph Sahaya; WARIKH, A. R. M.; CHER CHIA, Lee; KOK YAU, Chua; BOON HUAT, Lim. Bond strength evaluation of heat treated Cu-Al wire bonding. Journal of Mechanical Engineering and Sciences, [S. l.], v. 12, n. 4, p. 4275–4284, 2018. DOI: 10.15282/jmes.12.4.2018.21.0367. Disponível em: https://journal.ump.edu.my/jmes/article/view/382. Acesso em: 22 nov. 2024.