Shariza, S., Anand, T. J. S., Warikh, A. R. M., Cher Chia, L., Kok Yau, C., & Boon Huat, L. (2018). Bond strength evaluation of heat treated Cu-Al wire bonding. Journal of Mechanical Engineering and Sciences, 12(4), 4275–4284. https://doi.org/10.15282/jmes.12.4.2018.21.0367