Asasaari, S.F., Fadil, N.A. and Tamin, M.N. 2022. Mechanics of solder/IMC interface of lead-free solder interconnects in ball grid array assembly. Journal of Mechanical Engineering and Sciences. 16, 1 (Mar. 2022), 8718–8729. DOI:https://doi.org/10.15282/jmes.16.1.2022.06.0689.