Rosli SA, Jalar A, Abu Bakar M. Quantification of Corrosion on Cu Wire Bonding on Ag-Plated Lead Frame in HCl for Automotive Electronic Application. Int. J. Automot. Mech. Eng. [Internet]. 2024 Sep. 20 [cited 2024 Nov. 21];21(3):11596-605. Available from: https://journal.ump.edu.my/ijame/article/view/10748