ROSLI, S. A.; JALAR, A.; ABU BAKAR, M. Quantification of Corrosion on Cu Wire Bonding on Ag-Plated Lead Frame in HCl for Automotive Electronic Application. International Journal of Automotive and Mechanical Engineering, [S. l.], v. 21, n. 3, p. 11596–11605, 2024. DOI: 10.15282/ijame.21.3.2024.11.0894. Disponível em: https://journal.ump.edu.my/ijame/article/view/10748. Acesso em: 27 sep. 2024.