RISHAD, Shah Mohammad Azam; ISLAM, Md Shahidul; ISLAM, Md. Ashraful. Strength and Reliability of Adhesive-Bonded Joints in Semiconductor Packaging: A Computational Analysis. International Journal of Automotive and Mechanical Engineering, [S. l.], v. 22, n. 2, p. 12483–12495, 2025. DOI: 10.15282/ijame.22.2.2025.17.0954. Disponível em: https://journal.ump.edu.my/ijame/article/view/11064. Acesso em: 27 jun. 2025.