Rishad, S. M. A.; Islam, M. S. .; Islam, M. A. Strength and Reliability of Adhesive-Bonded Joints in Semiconductor Packaging: A Computational Analysis. Int. J. Automot. Mech. Eng. 2025, 22 (2), 12483-12495. https://doi.org/10.15282/ijame.22.2.2025.17.0954.