Rosli, S.A. et al. 2024. Quantification of Corrosion on Cu Wire Bonding on Ag-Plated Lead Frame in HCl for Automotive Electronic Application. International Journal of Automotive and Mechanical Engineering. 21, 3 (Sep. 2024), 11596–11605. DOI:https://doi.org/10.15282/ijame.21.3.2024.11.0894.