Shariza S, Anand TJS, Warikh ARM, Cher Chia L, Kok Yau C, Boon Huat L. Bond strength evaluation of heat treated Cu-Al wire bonding. J. Mech. Eng. Sci. [Internet]. 2018 Dec. 27 [cited 2024 Apr. 18];12(4):4275-84. Available from: https://journal.ump.edu.my/jmes/article/view/382