SHARIZA, S.; ANAND, T. J. S.; WARIKH, A. R. M.; CHER CHIA, L.; KOK YAU, C.; BOON HUAT, L. Bond strength evaluation of heat treated Cu-Al wire bonding. Journal of Mechanical Engineering and Sciences, [S. l.], v. 12, n. 4, p. 4275–4284, 2018. DOI: 10.15282/jmes.12.4.2018.21.0367. Disponível em: https://journal.ump.edu.my/jmes/article/view/382. Acesso em: 26 apr. 2024.